Overcoming the Copper-Aluminum Bottleneck in Busbar Manufacturing
The Science of Solid-State Joining
Traditional fusion joining methods (Laser, Resistance, Soldering) rely on high-intensity thermal energy to melt materials. When applied to Copper (Cu) and Aluminum (Al), this melting triggers the formation of Intermetallic Compounds (IMCs)—hard, brittle layers that reduce mechanical life.
Our ultrasonic process creates a metallurgical bond without melting. High-frequency friction disrupts surface oxides and initiates lattice diffusion at the atomic level.
Why Traditional Processes Often Fail
Bimetallic busbars reduce weight and cost, but they introduce fatal engineering hurdles when heat is applied via conventional methods:
Intermetallic Fragility: The delta in melting points leads to uncontrollable eutectic reactions, making joints prone to cracking under vehicle vibrations.
Insulating Oxides: Aluminum's oxide layer is a persistent insulator. Fusion methods trap these oxides, leading to dangerous thermal runaway risks.
Thermal Mismatch: Copper's high conductivity draws energy away, causing the aluminum side to warp or suffer burn-through during welding.
Critical Application Scenarios
Because our ultrasonic equipment is insensitive to melting point differences, it is the premier choice for:
EV Battery Packs: Welding multi-layer copper foils to thick aluminum busbars.
Power Electronics: Connecting copper terminals to aluminum heat sinks without thermal damage to sensitive electronics.
HV Wire Harnesses: Securely compacting and welding stranded copper wires to aluminum terminals.
Performance Benchmarks
Equivalent to base metal conductivity, minimizing heat generation.
During destructive testing, the aluminum base metal tears before the weld fails.
Optimized for high-speed automated robotic assembly lines.
Consult Our Application Engineers
Send us your busbar materials for a free feasibility study, cross-sectional analysis, and resistance mapping.
